| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic apparatus, the electronic apparatus, a manufacturing method of an electronic apparatus package, and the electronic apparatus package which do not cause displacement of electronic components, make damage to a sealing material and the electronic components less likely to occur, and easily remove residues when the residue is adhered in a manufacturing process of a relocation type electronic apparatus. <P>SOLUTION: A manufacturing method of an electronic apparatus has a process in which a fixing resin layer 60 is formed on a support substrate 50, a process in which electronic components 11 are fixed, a process in which a sealing material layer 70 is formed, a process in which an electronic component arrangement sealant hardened material 80 is obtained, and a process in which the electronic component arrangement sealant hardened material 80 is peeled from the support substrate 50. In the peeling process, an active energy ray is radiated to the fixing resin layer 60. Then, the electronic component arrangement sealant hardened material 80 is peeled from the support substrate 50 by heating and melting the fixing resin layer 60. <P>COPYRIGHT: (C)2012,JPO&INPIT |
