发明名称 SYSTEM AND METHOD FOR SUBSTRATE PROCESSING
摘要 <P>PROBLEM TO BE SOLVED: To provide a system and a method for substrate processing which suppress foam phenomena of an exposed photosensitive resin material. <P>SOLUTION: A substrate processing system 1 includes a cleaning device 21, a resist application device 22, a periphery exposure device 23, a substrate transfer mechanism 30, and a system controller 10. The system controller 10 has a waiting period monitoring part 10B monitoring a waiting period of a substrate W, which starts when a resist film is formed by the resist application device 22 and ends when an exposure process is started by the periphery exposure device 23, and a process control part 10A causing the substrate transfer mechanism 30 to transfer the substrate W to the cleaning device 21 when the waiting period exceeds a time limit. The process control part 10A causes the substrate W in which the resist film is removed by the cleaning device 21 to be transferred to the resist application device 22. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012114259(A) 申请公布日期 2012.06.14
申请号 JP20100262217 申请日期 2010.11.25
申请人 LAPIS SEMICONDUCTOR CO LTD 发明人 IDE TOSHIYUKI
分类号 H01L21/027;H01L21/677 主分类号 H01L21/027
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