| 发明名称 |
DUMMY FRAME AND RESIN MOLDING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dummy frame by which a sealing resin of a semiconductor chip can be evaluated with high accuracy without using an actual semiconductor mounting substrate. <P>SOLUTION: A dummy frame 110 for use in evaluation of a mold resin of a semiconductor mounting substrate mounting at least one semiconductor chip, has: a planar metal plate 100 simulating the semiconductor mounting substrate; and at least one convex 120 simulating the semiconductor chip and being mounted on the metal plate 100. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012114305(A) |
申请公布日期 |
2012.06.14 |
| 申请号 |
JP20100263065 |
申请日期 |
2010.11.26 |
| 申请人 |
APIC YAMADA CORP |
发明人 |
MORIMURA MASAHIRO;TAKAHASHI YUICHI;HORIGUCHI TOMOAKI;MAEKAWA MASANORI |
| 分类号 |
H01L21/56;B29C45/14;B29C45/17;B29K105/22 |
主分类号 |
H01L21/56 |
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