发明名称 LEAD FRAME AND APPARATUS FOR MANUFACTURING THE SAME, AND SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a lead frame which is capable of improving weldability of a capacitor element, and to provide an apparatus for manufacturing the same, a solid electrolytic capacitor provided with the lead frame, and a method for manufacturing the solid electrolytic capacitor. <P>SOLUTION: There are provided the lead frame, the apparatus for manufacturing the same, the solid electrolytic capacitor provided with the lead frame, and the method for manufacturing the solid electrolytic capacitor. The lead frame is characterized in that at least one projection is formed at a welding portion at which the lead frame and an electrode lead-out terminal are to be welded together. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012114438(A) 申请公布日期 2012.06.14
申请号 JP20110254426 申请日期 2011.11.21
申请人 NICHICON CORP;FPCAP ELECTRONICS (SUZHOU) CO LTD 发明人 FUKUSHI KAZUHIKO;ISHIZUKA HIDETOSHI
分类号 H01G9/15;H01G9/00;H01G9/004;H01G13/00 主分类号 H01G9/15
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