MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING A HEAT-RESISTANT ADHESIVE SHEET
摘要
PURPOSE: A semiconductor device manufacturing method which utilizes heat-resistant adhesive sheet is provided to reduce the number of defective products created due to an adhesive sheet in a loading process by attaching a heat-resistant adhesive sheet after the loading process. CONSTITUTION: A metal lead frame is prepared. A semiconductor chip is loaded on the metal lead frame. A lead of the metal lead frame and the semiconductor chip are connected through a wire. The metal lead frame is attached to a heat-resistant adhesive sheet(1). The semiconductor chip is sealed using a sealing resin. The heat-resistant adhesive sheet is removed after sealing the semiconductor chip.
申请公布号
KR20120062667(A)
申请公布日期
2012.06.14
申请号
KR20120046013
申请日期
2012.05.01
申请人
TORAY ADVANCED MATERIALS KOREA INC.
发明人
PARK, YUN MIN;JEON, HAE SANG;MOON, KI JEONG;SIM, CHANG HOON;CHOI, SUNG HWAN