发明名称 PLASMA GENERATING METHOD AND SUBSTRATE TREATING APPARATUS AND METHOD USING THE PLASMA GENERATING METHOD
摘要 PURPOSE: A plasma generation method, a substrate processing apparatus using the same, and a method thereof are provided to increase a production amount of hydrogen plasma by adding auxiliary gas, thereby improving ashing efficiency. CONSTITUTION: A susceptor(140) is located inside a process chamber. A plasma support part(200) generates plasma inside a discharge space located on the upper part of a substrate and supplies the plasma to the substrate. A process gas supply part(250) supplies hydrogen gas to the discharge space. An auxiliary gas supply part(260) supplies auxiliary gas to the discharge space. Two or more gases among oxygen gas, helium gas, neon gas, and nitrogen gas are mixed for forming the auxiliary gas.
申请公布号 KR20120062533(A) 申请公布日期 2012.06.14
申请号 KR20100123832 申请日期 2010.12.06
申请人 PSK INC. 发明人 YANG, JAE KYUN;LEE, CHANG WEON
分类号 H01L21/3065 主分类号 H01L21/3065
代理机构 代理人
主权项
地址