发明名称 |
SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS |
摘要 |
A solid-state imaging device includes a supporting substrate that includes a concave portion, a solid-state imaging chip that is bonded on the supporting substrate so as to seal the concave portion in a view-angle region, a stress film that is formed on the surface of the solid-state imaging chip, and an imaging surface curved toward the concave portion at least in the view-angle region. |
申请公布号 |
US2012147207(A1) |
申请公布日期 |
2012.06.14 |
申请号 |
US201113299951 |
申请日期 |
2011.11.18 |
申请人 |
ITONAGA KAZUICHIROH;SONY CORPORATION |
发明人 |
ITONAGA KAZUICHIROH |
分类号 |
H04N5/228;H01L27/146;H01L31/18 |
主分类号 |
H04N5/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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