SEMICONDUCTOR INSPECTION DEVICE

摘要

Provided is a semiconductor inspection device with which semiconductors arranged in a row can be inspected at a higher speed than in the past. The semiconductor inspection device (1) measures the characteristics of a semiconductor element (LED chip (41)) that is adhered onto a sheet (adhesive sheet (45)). The semiconductor inspection device (1) is provided with: a frame-shaped holding member (wafer ring (43)) for holding the sheet; a probe (30) that is arranged above the semiconductor element and measures the characteristics of the semiconductor element by contacting electrode pads (41a, 41b) of the semiconductor element; and an inner stage (small stage (20)) that is arranged below the sheet and is driven in the vertical direction within the holding member. When the characteristics of the semiconductor element are measured, the probe (30) is fixed and the inner stage is raised from below the sheet so that the characteristics can be measured by partially raising the semiconductor element through the sheet and bringing the electrodes of the semiconductor element into contact with the probe (30).