| 摘要 |
PURPOSE: A method for manufacturing an electro-formed master for flexible electronic circuit parts is provided to improve mass production in a plating process by remarkably enhancing an adhesive force of an insulating material and a stainless steel at a non-plating area. CONSTITUTION: A photosensitive layer, in which a desired circuit pattern(150) is formed, is formed through an exposure process after laminating a photosensitive film on a metal board(100). A circuit pattern master is manufactured by eliminating the photosensitive layer with stripping liquor after etching the metal board. An entire surface of the circuit pattern master is processed with raydent coating. The entire surface of the circuit pattern master is filled with an insulating material(300). A surface of the metal board is exposed by polishing the surface of a circuit board master.
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