| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance the processing speed of a substrate alignment device having a temperature adjustment function. <P>SOLUTION: The alignment method includes a step for performing first alignment based on a notch position on the outer periphery of a substrate, a step for performing second alignment based on the outer peripheral shape of the substrate including the notch, and a temperature adjustment step for adjusting the temperature of the substrate to a target management temperature. In the method, the second alignment step of the (N-1)th substrate, and the temperature adjustment step of the (N-1)th substrate are performed during the first alignment step of the N-th substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
