发明名称 WET ETCHING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an etching apparatus which prevents air bubbles departing from a semiconductor substrate (a solar cell) from adhering to the semiconductor substrate again and causing non-uniform etching and shape defects. <P>SOLUTION: A wet etching apparatus includes: an etching bath 5 accumulating an etching solution 4 in which a solar cell 2 is immersed; a circulation water passage system 20A which recovers the etching solution 4 on an upper layer of the etching bath 5 and ejects the recovered etching solution 4 from a bottom part of the etching bath 5 to circulate the etching solution 4 in the etching bath 5; and an air bubble capturing collector 1A which is immersed between the solar cell 2 and a liquid surface of the etching solution 4 in the etching bath 5 to capture and collect air bubbles 7 generated from the solar cell 2 and floating in the etching bath 5. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012114211(A) 申请公布日期 2012.06.14
申请号 JP20100261342 申请日期 2010.11.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKENAKA MICHIAKI;OMORI NOBUHIKO
分类号 H01L21/306;H01L21/308;H01L31/04 主分类号 H01L21/306
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