| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which allows for electrical inspection of whether or not the deviation of an inner layer pattern from an interlayer connection via falls within an allowable range, with a small number of detection units, without having an impact on the finish state of the inner layer pattern by etching. <P>SOLUTION: The multilayer printed wiring board has a circular land on the surface layer thereof, a circular microvia communicating from the land to the inner layer surface thereof, and an inspection pattern with a pair of conductors provided on the inner layer surface of the multilayer printed wiring board, facing each other via a space conducting electrically with the microvia, when the deviation of the inner layer pattern of the multilayer printed wiring board falls within an allowable range. <P>COPYRIGHT: (C)2012,JPO&INPIT |
