| 摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a component side; mounting a base device having a base circuit connector directly on the component side; attaching conformal interconnects, having the same pre-deformation height from the component side, directly on the component side and offset from the base device; and attaching a stack substrate having stack interconnects directly on the conformal interconnects, portions of the stack interconnects covered by the conformal interconnects having different deformation heights from the component side.
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