CONDUCTING PATH, SEMICONDUCTOR DEVICE USING CONDUCTING PATH, AND METHOD FOR PRODUCING CONDUCTING PATH AND SEMICONDUCTOR DEVICE

摘要

A conducting path includes: a first conducting path forming plate (11) composed of a first metal and having a through hole (13); and a second conducting path forming plate (15) composed of a second metal and having an indentation (17) that is inserted in the through hole. The wall surfaces of the through hole and the side surfaces of the indentation form an inclined junction surface (18) that is inclined toward the normal line of the surface where the first conducting path forming plate (11) and the second conducting path forming plate (15) overlap each other. A junction (25) is formed by metal flow on an area near the inclined junction surface.