| 摘要 |
PURPOSE: A system in-packaging method of a semi-active focal plane array(SA-FPA) sensor using a diode switching process is provided to attach an SA-FPA sensor chip and an output control integrated circuit chip on the same wafer level by separately arranging the SA-FPA sensor chip and the output control integrated circuit chip, thereby detecting a malfunction of an output control integrated circuit in beforehand. CONSTITUTION: An insulating film(110) is laminated on a substrate(100). An ROIC(Read-Out Integrated Circuit) cap(120) and a bolometer array cap(130) are arranged side by side on the surface of the insulating film. The ROIC cap packages an output control integrated circuit chip. The bolometer array cap packages a bolometer array. An ROIC and the substrate are connected to each other using a wire bonding process and/or a flip chip bonding process.
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