| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a coating type diffusion agent composition containing an impurity diffusion component, which can ensure a sufficient film thickness when it is applied to a semiconductor substrate, and is less susceptible to cracking when calcination or diffusion is performed after it is applied to a substrate having a step. <P>SOLUTION: The diffusion agent composition contains a condensation product (A) where alkoxysilane represented by a general formula (1) is the starting material, an impurity diffusion agent (C), and an organic solvent (D). In the general formula (1), R<SP POS="POST">1</SP>, R<SP POS="POST">2</SP>are organic groups, an a plurality of R<SP POS="POST">1</SP>, R<SP POS="POST">2</SP>may be the same or different; m is 0, 1 or 2; when m=0, the condensation product (A) may be formed of a plurality of (1), and always contains alkoxysilane of m=1 or 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
