CIRCUIT PATTERN EVALUATION METHOD, AND SYSTEM FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To improve throughput without deterioration of evaluation performance of a scanning charged-particle microscope.

SOLUTION: A method of evaluating shapes of circuit patterns formed on a semiconductor wafer using a scanning charged-particle microscope, includes: acquiring an image including a plurality of evaluation patterns by performing image capturing on a semiconductor wafer which is formed such that the plurality of evaluation patterns are contained within one field of view of the scanning charged-particle microscope using the scanning charged-particle microscope; adjusting image quality of the image by controlling the scanning charged-particle microscope using a pattern different from the plurality of evaluation patterns contained within the field of view of the scanning charged-particle microscope in the acquired image containing the plurality of evaluation patterns; sequentially acquiring images of the plurality of evaluation patterns within the field of view containing the plurality of evaluation patterns due to image shift by controlling the scanning charged-particle microscope for which the image quality is adjusted; and evaluating the shapes of the plurality of circuit patterns using the images of the plurality of evaluation patterns which are sequentially acquired due to the image shift.

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