| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a near infrared ray absorbing resin composition which has a reduced change in optical properties and has excellent moldability under high temperature conditions such as a solder reflow step or the like. <P>SOLUTION: The near infrared ray absorbing resin composition is composed of a curable composition containing: a near infrared ray absorbing substance composed of a single selected from a quaterrylene compound and a pentarylen compound or their combination; and a hexarylen compound in an essential component as a near infrared ray absorbing substance, in which light transmittance at 400 to 700 nm is ≥50%, and light transmittance at 700 to 1,000 nm is ≤10%. <P>COPYRIGHT: (C)2012,JPO&INPIT |
