BASE FILM AND ADHESIVE FILM FOR SEMICONDUCTOR DEVICES USING THE SAME

摘要

PURPOSE: A base material film and an adhesive film for semiconductor using thereof are provided to prevent a collapse phenomenon and defects in post semiconductor packing process. CONSTITUTION: An adhesive film for semiconductor(110) includes a base film and a tackifier layer(114) which is coated in one side of the base material film. A coefficient of linear expansion at 0-5 deg. Celsius of the base material film is 50-150 microns/m*deg. Celsius, and a thermal shrinkage ratio at 5 deg. Celsius after 120 hours is greater than 0 and less than 0.1%. The tackifier layer is a UV-curable adhesive layer. The adhesion layer comprises a binder, a thermosetting material, and a photo initiator. The adhesive film additionally includes an adhesive layer(116) and a protection film(118) which are successively laminated in one side of the adhesion layer.