| 摘要 |
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to improve circuit performance by providing a short electrical conductance path from an active device to a conduction track on a printed circuit board. CONSTITUTION: A semiconductor device includes a semiconductor die(58) which has a plurality of complex bumps(110,112) on the surface of the die. A conductive trace is formed on a substrate. The conductive trace includes an interconnection site which has an edge parallel to the conductive trace from a flat surface in order to increase escape routing density. A flexible part of the complex bump covers the top and side parts of the interconnection site by being combined with the interconnection site. An encapsulating material is electroplated near the complex bump between the semiconductor die and the substrate. |
