| 摘要 |
PURPOSE: An electroplating apparatus and process for wafer level packaging are provided to reduce costs by minimizing the use of expensive electrolytic materials and the production of expensive waste including electrolytic materials. CONSTITUTION: An electroplating apparatus(200) simultaneously electroplates cheap first metal and expensive second metal on a substrate. The electroplating apparatus comprises an anode chamber(245), a cathode chamber(225), a separating structure(250), a fluid characteristic part(261), and a controller. The anode chamber comprises active anodes(210) and anolyte containing first metal. The cathode chamber comprises catholyte and a substrate. The separating structure is located between the anode chamber and the cathode chamber. The fluid characteristic part performs one or more operations. The controller is associated with the fluid characteristic part.
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