WATER-SOLUBLE CUTTING FLUID FOR SLICING SILICON INGOTS

摘要

A water-soluble cutting fluid for slicing silicon ingots is characterized in that it includes a monoprotic or diprotic aliphatic carboxylic acid (A) having a carbon number (including the carbon in the carbonyl group) of 4˜10, and either a polyprotic organic acid (B) with &Dgr;pKa of 0.9˜2.3 as defined by the following formula (1) or a salt (BA) of said organic acid (B) as essential components: &Dgr;pKa=(pKa2)−(pKa1)   (1) wherein the dissociation stage, at which the organic acid (B) denoted as n-protic acid HnA, becomes Hn-1A+H+ is numbered 1 with an acid dissociation constant expressed as pKa1, and the dissociation stage at which the organic acid (B) becomes Hn-2A+H+ is numbered as 2 with an acid dissociation constant expressed as pKa2.