发明名称 LED LAMP DEVICE AND MANUFACTURING METHOD
摘要 PURPOSE: An LED chip lamp device and a manufacturing method thereof are provided to enhance illuminance by using a hexagonal or octagonal radiation lamp post instead of a square radiation lamp post. CONSTITUTION: LED chip boards(40) are respectively coupled to the sides of a square radiation lamp post(50). A bulb type socket body(20) is completed by assembling a circular electric circuit board(30). A transparent cylindrical outer body(10) with open bottom and external threads is used as a socket bulb coupled to the socket body. The cylindrical electric circuit board, the LED chip boards, and the square radiation lamp post are assembled into a finished product.
申请公布号 KR20120061194(A) 申请公布日期 2012.06.13
申请号 KR20100122385 申请日期 2010.12.03
申请人 PARK, JONG HOO 发明人 PARK, JONG HOO
分类号 F21V17/00;F21V29/00;F21Y101/02 主分类号 F21V17/00
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