| 摘要 |
<p>PURPOSE: A stacked semiconductor package and a manufacturing method thereof are provided to improve the performance of a semiconductor package by multi-layer stacking without wire bonding. CONSTITUTION: A conductive pattern(102,104) is formed on the upper and lower sides of a substrate(100). An interposer(110-140) is stacked on the upper side of the substrate in zigzag of two rows. A plurality of semiconductor devices are mounted on the interposer and the substrate. A plurality of semiconductor dies(200-250) are mounted on the substrate. A molding unit(300) is formed on the upper side of the substrate to seal the plurality of the semiconductor dies.</p> |
