发明名称 MEMS device having contact and standoff bumps and method of actuating
摘要 <p>MEMS Switch Designs and Related Methods. According to one embodiment, a movable, trilayered microcomponent suspended over a substrate is provided and includes a first electrically conductive layer patterned to define a movable electrode. The first metal layer is separated from the substrate by a gap. The microcomponent further includes a dielectric layer formed on the first metal layer and having an end fixed with respect to the substrate. Furthermore, the microcomponent includes a second electrically conductive layer formed on the dielectric layer and patterned to define an electrode interconnect for electrically communicating with the movable electrode.</p>
申请公布号 EP1760036(B1) 申请公布日期 2012.06.13
申请号 EP20060126731 申请日期 2002.11.08
申请人 WISPRY, INC. 发明人 DEREUS, DANA, R.
分类号 B81B3/00;B81B7/00;H01H1/04;H01H1/50;H01H59/00;H01H61/04;H01L21/302;H01L23/373;H01L23/522;H01L27/12;H01L29/86;H02N1/00;H02N10/00 主分类号 B81B3/00
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