| 摘要 |
PURPOSE: A wafer expanding apparatus is provided to prevent damage to a die by preventing a wafer tape from being separated from a wafer ring and contracted. CONSTITUTION: A wafer expanding apparatus includes a support member(110), a clamp member(120), and a friction member(130). The support member supports an area between a wafer and a wafer ring. The clamp member receives a part of a wafer ring and expands a wafer tape by pressurizing the wafer ring in a first direction which is vertical to the wafer. A friction member faces the wafer ring and pressurizes the lower side of the wafer tape in a second direction which is opposite to the first direction.
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