| 摘要 |
A multilayer printed wiring board of the present invention is characterized by a first interlayer resin insulation layer; a pad for mounting an electronic component formed on the first interlayer resin insulation layer; a solder-resist layer formed on the first interlayer resin insulation layer and the pad, and having an opening portion that reaches the pad; and a protective film positioned at the bottom of the opening portion and formed on the pad. In such a multilayer printed wiring board, a metal layer is formed on the surface of the pad, containing at least one metal from among Sn, Ni, Zn, Co, Ti, Pd, Ag, Pt and Au; a coating film made of a coupling agent is formed on the metal layer; and at least part of the protective film is formed directly on the exposed surface of the pad, which is exposed through the opening portion. |
