| 摘要 |
PURPOSE: A substrate carrier unit of a chemical mechanical polishing apparatus is provided to maintain slurry flowing in a substrate since the device is rotated to one direction. CONSTITUTION: In a substrate carrier unit of a chemical mechanical polishing apparatus, a polishing table rotates a platen pad. A carrier unit holds the substrate to be surrounded by a retainer ring(120) and rotates the substrate. A plurality of slurry inducing grooves(123,124) are formed along columnar direction in the retainer ring by a certain interval between them. The retainer ring forms a plurality of protrusions(121,122) along the columnar direction of the carrier unit.
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