Method of manufacturing semiconductor device and wire bonding apparatus

摘要

A terminal of a compact wire loop with a great strength of bonding is formed by a method including: a first folding step in which a tip end of a capillary is raised by a height of H1 from a point 86a where the center of the capillary is positioned during second bonding on a lead 74 to a point “p”, and then moved horizontally by a first distance of L1 toward a pad 73, and lowered to a point “r”; a second folding step in which the tip end of the capillary is raised from the point “r” to a height of H2 and then moved horizontally toward the lead 74 by a second distance of L2; and a third bonding step in which the center of the capillary is aligned with and then lowered to a point 87a on the lead 74 adjacent to the point 86a.