| 发明名称 |
Methods of forming sputtering targets |
| 摘要 |
In various embodiments, sputter-target formation includes application of a layer having an intermediate coefficient of thermal expansion between the backing plate and the target material.
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| 申请公布号 |
US8197894(B2) |
申请公布日期 |
2012.06.12 |
| 申请号 |
US20070937164 |
申请日期 |
2007.11.08 |
| 申请人 |
MILLER STEVEN A.;SCHMIDT-PARK OLAF;KUMAR PRABHAT;WU RICHARD;SUN SHUWEI;ZIMMERMANN STEFAN;H.C. STARCK GMBH;H.C. STARCK INC. |
发明人 |
MILLER STEVEN A.;SCHMIDT-PARK OLAF;KUMAR PRABHAT;WU RICHARD;SUN SHUWEI;ZIMMERMANN STEFAN |
| 分类号 |
B05D1/12 |
主分类号 |
B05D1/12 |
| 代理机构 |
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