| 摘要 |
A camera module package. A housing is provided with a lens barrel having at least one lens contained therein. At least one IR filter is also provided in the housing. A board, which is assembled to the housing, has at least one reinforcement material stacked thereon and at least one passive device mounted thereon. An image sensor is assembled to a lower surface of the board with its image region exposed through a window of the board. The present invention prevents contamination by an adhesive spreading over outer periphery of the board during flip-chip bonding of the board and the sensor, increases the rigidity of the board to prevent damage to the board during the assembly into the housing, and promotes miniaturization of the module. |
