| 摘要 |
Semiconductor vacuum equipment is provided to minimize the damage of an O-ring by making a cross-sectional area of the O-ring corresponding to the groove of a door valve to be thicken in comparison with the other cross-sectional area over two times. Semiconductor vacuum equipment includes a vacuum chamber and an O-ring. The vacuum chamber includes a gate door valve. The O-ring(121) is installed at the gate door valve of the vacuum chamber. The cross-section of the O-ring is larger at two or more portions than at the other portion. The gate door valve includes an O-ring insertion groove and an O-ring detaching/attaching groove. The O-ring insertion groove is composed of at least two groove portions corresponding to the large cross-section portions of the O-ring.
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