发明名称 |
Optimization of metallurgical properties of a solder joint |
摘要 |
Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided. |
申请公布号 |
US8197612(B2) |
申请公布日期 |
2012.06.12 |
申请号 |
US20080111524 |
申请日期 |
2008.04.29 |
申请人 |
BUSBY JAMES A;LU MINHUA;OBERSON VALERIE A;PERFECTO ERIC D;SRIVASTAVA KAMALESH K;SUNDLOF BRIAN R;SYLVESTRE JULIEN;WEISMAN RENEE L;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BUSBY JAMES A;LU MINHUA;OBERSON VALERIE A;PERFECTO ERIC D;SRIVASTAVA KAMALESH K;SUNDLOF BRIAN R;SYLVESTRE JULIEN;WEISMAN RENEE L |
分类号 |
B23K35/22 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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