发明名称 |
Intermediate structure of semiconductor device and method of manufacturing the same |
摘要 |
An intermediate structure for semiconductor devices includes a wiring board, a plurality of semiconductor chips mounted on the wiring board, and a sealing body for collectively sealing the plurality of semiconductor chips and having a region with a different thickness.
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申请公布号 |
US8198141(B2) |
申请公布日期 |
2012.06.12 |
申请号 |
US20090636959 |
申请日期 |
2009.12.14 |
申请人 |
ITO YOUKOU;OHBA TAKASHI;ELPIDA MEMORY, INC. |
发明人 |
ITO YOUKOU;OHBA TAKASHI |
分类号 |
H01L21/50;H01L21/44;H01L21/48 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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