发明名称 |
Multi-layer SoC module structure |
摘要 |
A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.
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申请公布号 |
US8199510(B2) |
申请公布日期 |
2012.06.12 |
申请号 |
US20100685723 |
申请日期 |
2010.01.12 |
申请人 |
HUANG CHUN-MING;WU CHIEN-MING;YANG CHIH-CHYAU;CHEN SHIH-LUN;WEY CHIN-LONG;CHEN CHI-SHI;LIN CHI-SHENG;NATIONAL CHIP IMPLEMENTATION CENTER;NATIONAL APPLIED RESEARCH LABORATORIES |
发明人 |
HUANG CHUN-MING;WU CHIEN-MING;YANG CHIH-CHYAU;CHEN SHIH-LUN;WEY CHIN-LONG;CHEN CHI-SHI;LIN CHI-SHENG |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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