发明名称 |
Mold and substrate for use with mold |
摘要 |
A mold (10) including a first mold part (12) and a second mold part (14) define a mold cavity (16) therebetween. A gate (18) is formed in at least one of the first and second mold parts (12) and (14) such that the gate (18) communicates with the mold cavity (16). A vent (20) having a constricted portion (22) is arranged to communicate with the mold cavity (16). A substrate (28) including a base substrate (30) and an electrically conductive pattern (32) and (34) formed on the base substrate (30) may be received in the mold (10). A solder resist layer (36) is formed on the base substrate (30) and a portion of the electrically conductive pattern (32). A plurality of grooves (38) and (40) is formed in a staggered arrangement around a periphery of a molding area (42) on the substrate (28). |
申请公布号 |
US8198143(B2) |
申请公布日期 |
2012.06.12 |
申请号 |
US201113097066 |
申请日期 |
2011.04.29 |
申请人 |
EU POH LENG;LOW BOON YEW;WONG WAI KEONG;FREESCALE SEMICONDUCTOR, INC. |
发明人 |
EU POH LENG;LOW BOON YEW;WONG WAI KEONG |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|