发明名称 |
Positive photosensitive resin composition |
摘要 |
Disclosed is a positive photosensitive resin composition that includes (A) a first polybenzoxazole precursor that includes: a repeating unit of Chemical Formula 1 and a thermally polymerizable functional group at at least one terminal end; (B) a second polybenzoxazole precursor that includes a repeating unit of Chemical Formula 3; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent.
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申请公布号 |
US8198002(B2) |
申请公布日期 |
2012.06.12 |
申请号 |
US20090581974 |
申请日期 |
2009.10.20 |
申请人 |
JUNG DOO-YOUNG;JEONG JI-YOUNG;CHO HYUN-YONG;YOO YONG-SIK;CHUNG MIN-KOOK;LEE JONG-HWA;LEE KIL-SUNG;CHA MYOUNG-HWAN;CHEIL INDUSTRIES INC. |
发明人 |
JUNG DOO-YOUNG;JEONG JI-YOUNG;CHO HYUN-YONG;YOO YONG-SIK;CHUNG MIN-KOOK;LEE JONG-HWA;LEE KIL-SUNG;CHA MYOUNG-HWAN |
分类号 |
G03F7/023 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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地址 |
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