| 摘要 |
Provided is a plating device applicable to a print circuit board. The plating device comprises: a plating groove accepting the print circuit board, a first injection unit and a second injection unit which are formed at different positions of the edge of the print circuit board contained in the plating groove and composed of multiple nozzles for injecting plating solution, and a first guide direction and a second guide direction which are formed ahead of the first injection unit and the second injection unit and change the flowing of the plating solution injected from the first and second injection units to the print circuit board.
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