Chip stack package using spring and method for manufacturing the same

摘要

PURPOSE: A stack package using a spring connecting and a manufacturing method thereof are provided to prevent electrical characteristic from decreasing even a substrate is deformed by connecting a through electrode of a stack package with a spring. CONSTITUTION: A first substrate(100) includes a connection pad. A second substrate(200) is laminated on an upper portion of the first substrate. The second substrate includes a second through electrode(302) in a location corresponding to the connection pad. An adhesive(500) bonds the first substrate with the second substrate. A spring(400) electrically connects the connection pad and the second through electrode.