| 摘要 |
PURPOSE: A bonding structure of a semiconductor package, a manufacturing method thereof, and a stack type semiconductor package are provided to improve the yield and reliability of a semiconductor device by constituting a bonding pad electrically connected to one conductive structure with a plurality of sub bonding pads which is separated each other. CONSTITUTION: A first chip(410) includes a first conductive structure(412) and a first bonding pad(104). The first bonding pad is composed of a plurality of sub bonding pads(104a,104b,104c,104d) which is separated each other. A second chip(420) includes a second conductive structure(422) and a second bonding pad(124). The first chip and the second chip are electrically connected through a bonding structure. The second chip and a third chip are electrically connected through a second bonding structure(126). |
