发明名称 A measuring device for thermal conductivity and thermal expansion coefficient at cryogenic temperature and method for simultaneous measurment of thermal conductivity and thermal expansion coefficient
摘要 PURPOSE: A device for measuring the ultra-low temperature heat conductivity and a thermal expansive coefficient and a method for simultaneously measuring the heat conductivity and thermal expansive coefficient using the same is provided to reduce a time create a ultra-low temperature condition inside a partitioned space, to improve a measuring speed, and to generate a thermal flow at a constant speed without a heat loss by spacing a heater mount arranged in a side of a specimen from a base. CONSTITUTION: A device(100) for measuring the ultra-low temperature heat conductivity and a thermal expansive coefficient comprises a base(110), a holder(120), a heater mount(130), a sensor, a first chamber(150), a second chamber(160), a third chamber, a cooling part, and a heat conduction part. The base supports a first specimen where a thermal expansive coefficient is measured. The holder restrains one side of a second specimen where the heat conductivity is measured, thereby separating the second specimen from the base. The heater mount spaced from the holder houses an outer surface of one side of the second specimen, thereby transferring heat supplied from outside to the second specimen. The sensor measures a temperature change or strain amount in the base, the first specimen, and the second specimen. The first chamber houses the base and holder in inside, thereby forming a predetermined space. The second chamber houses the first chamber, thereby forming a predetermined space.
申请公布号 KR20120059799(A) 申请公布日期 2012.06.11
申请号 KR20100121247 申请日期 2010.12.01
申请人 KOREA INSTITUTE OF MACHINERY & MATERIALS 发明人 LEE, WON OH;UM, MOON KWANG;HWANG, BYUNG SUN;BAN, CHANG SU
分类号 G01N25/18;G01N25/16 主分类号 G01N25/18
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