| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce manufacturing costs by removing an epoxy under plating process and a pad forming process for mounting an electronic device. CONSTITUTION: An electronic device(150) is mounted on a circuit pattern. A solder(140) is formed between the circuit pattern and the electronic device. The solder electrically connects the circuit pattern to the electronic device. An insulation layer(160) buries the mounted electronic device. A location pattern is formed on a region corresponding to a mounting position of an electronic device.
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