| 摘要 |
PURPOSE: A substrate plating apparatus is provided to remove bubble remaining in a substrate by prewetting the substrate inside a process chamber. CONSTITUTION: A substrate plating apparatus comprises a process chamber(110) and a prewetting unit(150). The process chamber accommodates electrolyte and has a target part(120) which generates plus metal ion when applied with anode voltage. A chuck(125) for clamping a substrate is arranged in the upper side of the process chamber, lifted, and rotated. The prewetting unit can move toward the underside of the substrate within the process chamber. The prewetting sprays prewetting liquid to the substrate and collects the liquid.
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