| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device that has a structure capable of preventing the spreading of an adhesive for fixing an LED, is easy to minimize and to change its shape, and has high heat dissipation, and to provide a method of manufacturing the same. <P>SOLUTION: A semiconductor light-emitting device comprises: a substrate; conductor wiring that is composed of a multilayer metal film and is formed on the substrate; at least one semiconductor light-emitting element mounted on the conductor wiring via an adhesive; a groove that penetrates at least one layer of the conductor wiring and is provided around at least one semiconductor light-emitting element. The metal layer exposed at the bottom of the groove has a lower wettability to the adhesive than the top metal layer of the multilayer metal film. <P>COPYRIGHT: (C)2012,JPO&INPIT |
