发明名称 |
PRESSURE SENSOR AND METHOD OF ASSEMBLING SAME |
摘要 |
A method of packaging a pressure sensing die includes providing a lead frame with lead fingers and attaching the pressure sensing die to the lead fingers such that bond pads of the die are electrically coupled to the lead fingers and a void is formed between the die and the lead fingers. A gel material is dispensed via an underside of the lead frame into the void such that the gel material substantially fills the void. The gel material is then cured and the die and the lead frame are encapsulated with a mold compound. The finished package does not include a metal lid.
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申请公布号 |
US2012139063(A1) |
申请公布日期 |
2012.06.07 |
申请号 |
US20100960571 |
申请日期 |
2010.12.06 |
申请人 |
LO WAI YEW;TAN LAN CHU;FREESCALE SEMICONDUCTOR, INC |
发明人 |
LO WAI YEW;TAN LAN CHU |
分类号 |
H01L29/84;H01L21/04 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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