发明名称 METAL-CLAD LAMINATE, METHOD OF MANUFACTURING THE SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a metal-clad laminate in which a metal foil is firmly bonded with a base material while exhibiting superior electrical characteristics. <P>SOLUTION: The metal-clad laminate includes the metal foil and a first resin layer that is provided on the metal foil. The metal-clad laminate is characterized in that the first resin layer is composed of an epoxy resin and a fluorine-containing polymer that has a curable functional group. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012106491(A) 申请公布日期 2012.06.07
申请号 JP20110233540 申请日期 2011.10.25
申请人 DAIKIN INDUSTRIES LTD 发明人 YAMAMOTO YOSHIHISA;YOSHIMOTO HIROYUKI;NAKAGAWA HIDETO
分类号 B32B15/092;B32B15/08;B32B15/082;H05K1/03 主分类号 B32B15/092
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