发明名称 THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION, MOLDED MATERIAL, AND LIGHT EMITTING BODY
摘要 Disclosed is a method for producing a thermoplastic resin composition, wherein a metal complex (B) in which a ligand (C-1) is coordinated and a ligand (C-2) which has a higher boiling point than the ligand (C-1) at atmospheric pressure are blended into a thermoplastic resin (A) and then the resulting material is heated and mixed at a temperature not less than the boiling point of the ligand (C-1) but not more than the boiling point of the ligand (C-2), so that a light emitting material is dispersed in the thermoplastic resin in a good dispersion state at low cost. Consequently, a thermoplastic resin composition which is capable of providing a light emitting body having excellent transparency and excellent visible light emission characteristics is produced by the above-described method. Also disclosed are: a molded material that is obtained by molding the thermoplastic resin composition; and a light emitting body that is obtained by molding the thermoplastic resin composition.
申请公布号 WO2012073845(A1) 申请公布日期 2012.06.07
申请号 WO2011JP77294 申请日期 2011.11.28
申请人 MITSUBISHI RAYON CO., LTD.;NIINO, HIROSHI;AOKI, YUTAKA 发明人 NIINO, HIROSHI;AOKI, YUTAKA
分类号 C08L101/00;C08J3/20;C08K5/00;C08K5/56 主分类号 C08L101/00
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