| 摘要 |
<p>The present invention relates to a grinding method using a grinding device provided with: a grindstone which grinds an end face of a glass substrate; and nozzles which supply coolant cooling a grinded portion of the glass substrate, wherein the grindstone having the diameter (d) is rotationally driven to grind the end face of the glass substrate having a thickness of at most 1.2 mm, the glass substrate is sandwiched and the coolant is supplied at a position separated from a grinding position by the grindstone toward the traveling direction of the glass substrate with respect to the grindstone by the distance (x) at angles (?1, ?2) incident to respective principal surfaces of the glass substrate during the grinding, and the respective values of (?1), (?2), and (x/d) are in the ranges of 15º to 60º, 15º to 60º, and 0.04 to 0.05.</p> |
