| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that the amount of heat dissipation of electronic parts tends to increase with the development of high integration of the electronic parts and under these circumstances, higher thermal conductivity is demanded for cured products used in insulating materials of the electronic parts. <P>SOLUTION: There is provided a composition including a diepoxy compound represented by formula (1), a curing agent, and alumina, and the cured product is obtained by curing the composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
