| 摘要 |
<p>[Problem] To obtain a low-melting glass for sealing electronic component substrates, the glass being an unleaded, substantially PbO-free low-melting glass. [Solution] An unleaded low-melting glass composition characterized in containing, in mass%, 1 to 6 of SiO2, 5 to 12 of B2O3, 0 to 5 of Al2O3, 0 to 5 of ZnO, 0.1 to 3 of RO(MgO + CaO + SrO + BaO), 0.1 to 7 of CuO, and 60 to 75 of Bi2O3; and an electrically conductive paste material using the same. The unleaded low-melting glass composition is also characterized in having a coefficient of thermal expansion at 30 to 300°C of (70 to 100) × 10-7/°C, and a softening point of 400°C to 500°C.</p> |
